Shenzhen LuMeiJinYu Electronics Co.,Ltd
Shenzhen lumei Jinyu Electronics Co., Ltd. was founded in 2011, is a professional production of double-sided,multi-layer high-precision circuit board and OEM, ODM integration enterprise. It has a production area of more than 50000 square meters, more than 2000 employees and a monthly production capacity of 1.5 million square feet. The main products are high-precision through-hole board, , multi-layer circuit board, flexible circuit board, Rigid and flexible board and PCB Assembly, while providing SMT supporting services to customers.
Lvmay strives to be a win-win partner with customers, advocates quality first, and provides customers with reliable one-stop interconnection solutions. Our products are widely used in military units, scientific research and development, quantum satellites, industrial control, medical equipment, aerospace, drones, unmanned vehicles, high-speed rail trains, new energy batteries, power electronics, automobile LED lights, security, and other high-tech industries, providing customers with all aspects of product services, and have been unanimously recognized by many customers at home and abroad.
PCBS From Lvmay
1. Process Capability
2. Lead Time
3. Stack-Up
4.Product Type
Hi,If you have any PCB requirements pls send your Gerber files or PCB specification, we will reply to you ASAP. Thank you& best regards!
Shenzhen lumei Jinyu Electronics Co., Ltd. was founded in 2011, is a professional production of double-sided,multi-layer high-precision circuit board and OEM, ODM integration enterprise. It has a production area of more than 50000 square meters, more than 2000 employees and a monthly production capacity of 1.5 million square feet. The main products are high-precision through-hole board, , multi-layer circuit board, flexible circuit board, Rigid and flexible board and PCB Assembly, while providing SMT supporting services to customers.
Lvmay strives to be a win-win partner with customers, advocates quality first, and provides customers with reliable one-stop interconnection solutions. Our products are widely used in military units, scientific research and development, quantum satellites, industrial control, medical equipment, aerospace, drones, unmanned vehicles, high-speed rail trains, new energy batteries, power electronics, automobile LED lights, security, and other high-tech industries, providing customers with all aspects of product services, and have been unanimously recognized by many customers at home and abroad.
PCBS From Lvmay
1. Process Capability
| Technical Capability | |||
| Items | Mass | Sample | |
| layers | 2-68L | 2-120L | |
| Max. Board Thickness | 10mm(394mil) | 14mm(551mil) | |
| Min. Width/Space | Inner Layer | 50/50um | 40/40um |
| out layer | 65/65um | 50/50um | |
| Registration | Same Core | ±25um | ±20um |
| Layer to Layer | ±4.5mil | ±4mil | |
| Heavy Copper | 6oz | 30oz | |
| Min. Drill Hole Diameter | Mechanical | ≥0.15mm(6mil) | ≥0.1mm(4mil) |
| Laser | 0.1-0.35mm | 0.05-0.35mm | |
| () Max. Size (Finish Size) | Line-card | 850mmX570mm | 1000mmX570mm |
| Backplane | 1250mmX570mm | 1320mmX570mm | |
| () Aspect Ratio (Finish Hole) | Line-card | 20:1 | 27:1 |
| Backplane | 25:1 | 32:1 | |
| Raw Material | /Lead free/Halogon free | EM827, 370HR, S1000-2, IT180A, EM825, IT158, S1000 / S1155, R1566W,EM285,TU862HF,EM370D,IT170GRA1, Autolad1,Autolad3,NP175FBH,IT170GT,H175HF | |
| High Speed | Megtron4, TU872SLK, FR408HR,N4000-13Series, S7439C,TU863+,Megtron6, MW2000, IT968,EM891,Megtron7,MW4000,TU933,DS7409DVN,IT988GSE | ||
| High Frequency | Ro3003, Ro3006, Ro4350B, Ro4360G2, Ro4835, CLTE, Genclad, RF35, FastRise27,TLY series,AD series,RT6002 | ||
| Others | Polyimide, Tk, LCP, BT, C-ply, Fradflex, Omega, ZBC2000,ST115 | ||
| Surface Finish | ,,,OSP,,,/,OSP, HASL,ENIG,Immersion Tin,OSP,Immersion Silver,Gold finger,Electroplating Hard Gold/Soft Gold,Selective OSP, ENEPIG | ||
| Gold fingers(gold thickness) | 40U" | 60U" | |
| /Radio Frequency/Micro Strip Precision | Line Width | ±0.8mil/±0.5mil | ±0.6mil/±0.5mil |
| Line Length | ±1.5mil/±1.2mil | ±1.2mil/±1mil | |
| Metal base | Structure | Post-bonding, Pre-bonding, Sweat-soldering, Conductive adhesive, Press-fit,Embedded Coin(I, T U) | |
| HDI High Density Interconnect Capability | Structure | Max Layer count( any layer)18L | Max Layer count( any layer)18L/20L |
| Min Blind via size (mm) | 0.1mm/0.075mm | 0.075mm/0.075mm | |
| Min. Width/Space(out layer) | 65/65um 50/50um | 50/50um 40/40um | |
| Rigid&Flex | Structure | Book, Air-gap, Fly-tail, Unsymmetrical, Semi-flex | |
| Flex Layer Count max. | Max Layer count( any layer)12L | Max Layer count( any layer)14L | |
| Impedance Tolerance | +/-10% | +/-8% | |
| Flex Core Thk (Exclude copper) (um) | 20 | 12.5 | |
| Flex outline to Pattern tolerance(mm) | +/-0.1 | +/-0.05 | |
| Finished BD thk (mm) | 0.075 ~0.25 | 0.075 ~0.25 | |
| Raw material | DupontAP, AK, Panasonic RF-777, ITEQ IF, LCP, Tk | ||
| FPC | 1L, 2L | 1L: length 5000 meters, 2: length 46 meters(2oz),OSP | 1L: length 5000meters,2L: length 46meters(2oz),OSP |
| Roadmap 2019/2020 | |||
| Products | 2019 | 2020 | |
| /Mass/Sample | /Mass/Sample | ||
| Backplane | Layers | 68L/120L | 68L/120L |
| Max. Size (Finish Size) | 1250mmX570mm/1320mmX570mm | 1250mmX570mm/1320mmX570mm | |
| Max. Board Thickness | 10mm/14mm | 10mm/14mm | |
| (0.31mm) Aspect Ratio (Finish Holes 0.31mm) | 25/32 | 25/35 | |
| (0.36mm) Aspect Ratio (Finish Holes 0.36mm) | 27/33 | 27/33 | |
| Line-Card | Layers | 32L/36L | 36L/36L |
| /Min. Width/Space(out layer) | 3mil/3mil 2.5mil/2.5mil | 3mil/3mil 2.5mil/2.5mil | |
| /Min. Width/Space(inner layer) | 2.2mil/2.2mil 2mil/2mil | 2.2mil/2.2mil 2mil/2mil | |
| (0.20mm) Aspect Ratio (Finish Holes 0.20mm) | 20/25 | 22/25 | |
| (0.25mm) Aspect Ratio (Finish Holes 0.25mm) | 21/27 | 24/27 | |
| Impedance Tolerance | ±7%/±5% | ±5%/±5% | |
2. Lead Time
3. Stack-Up
4.Product Type
Hi,If you have any PCB requirements pls send your Gerber files or PCB specification, we will reply to you ASAP. Thank you& best regards!